CF-330 chip machine expansion
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One. Machine use:
CF-330 chip expansion is widely used in light-emitting diodes, small and medium-power transistors, integrated circuits and special semiconductor devices expand grain production processes within the enterprise.
II. Machine features:
① Double cylinder upper and lower control; ② temperature design, even modest expansion of the diaphragm surrounding; ③ heating, stretching, expanding crystal, solid film at one time; ④ heating temperature, the expansion time, adjustable uniform rate of return. ⑤ simple, single-class large output; ⑥ machine shape shown in Figure.
III. Technical parameters:
1. Power supply voltage: AC220V ± 10%, 50Hz
2. Working pressure: 4Kg/cm2
3. Temperature range: room temperature ~ 400 ℃
4. On the cylinder stroke: 150/200 mm
5. Under the cylinder stroke: 100 mm (can be two-way adjustable)
6. Expansion area: 120/270 cm2
7. Dimensions: Length 360mm × 300mm × high 850/950mm wide
8. Weight: 20kg
IV. Steps:
1. Plug in the power, quick connector connected to the high-pressure tracheal tube;
2. Turn the power switch, the temperature set at 75 ℃ (temperature difference between the different chips membrane ± 5 ℃);
3. On the cylinder will switch to "up" position, the die back to the top. Switch to the next cylinder "down" position, under the die back to the bottom of the (repeated several times under the cylinder moves, will rise more slowly adjusted to the speed the better);
4. Release the lock, set off on the workpiece plate, the solid crystal placed under the inner die, the chip placed under the die center of the film, chip side up, to die on the cover, locking latch;
5. Cylinder switch to the next "up" position, the next rising slowly die, the film began to spread around the grain and gradually widening the interval. When the chip from spreading to the original interval of about 2 to 3 times the stop rising. Rounded down to solid crystal flat on the outer membrane and the inner ring at the top;
6. On the cylinder will switch to "down" position, starting on the die under pressure, the diffusion film sets after the close positioning chip, the die back to the top;
7. Switch to the next cylinder "down" position, dropped to the bottom under the die, remove the expansion completed chip crystal film;
8. After expanding crystal trim excess membrane surface, sending plastic solid crystal prepared under the process.
Price: Negotiable
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