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★ breakthrough dual-dispensing structure, LED full range of products suitable for automated solid crystal, reduce duplication of investment and labor costs
★ 4 chips while providing solid crystal
★ full range of LED and full color products
★ offers two solid crystal glue conversion
★ improve efficiency to reduce labor costs
★ provide two separate dispensing system that allows easy conversion of two types of glue, to achieve one of a variety of chip solid crystal, to avoid repeated loading and unloading caused by poor product variety and production efficiency loss
Specifications:
1. using WindowsXP operating system
2. Chinese language interface touch screen operation
3. Working cycle time: 290ms
4. Positioning accuracy: ± 1.5mil
5. angle accuracy: ± 3
6. chip size: 6mil × 6mil ~ 100mil × 100mil
7. the use of stents: LED lamp, SMD, PCB, dot matrix, piranhas, high-power
8. Double Vision: Recognition accuracy and positioning system Adjustable
9. Power: 220V ± 10V, 50HZ
10. Power: 1300W
11. air source (pressure): 3 ~ 5Kgf / c ㎡
12. Built-in uninterruptible power systems (UPS)
13. External Vacuum Generating System
14. Unlimited number of stored procedures
15. Dual LCD color display
16. more independent control of wafer
17. leak detection crystal
Size and weight:
Dimensions (L × W × H): 1000mm × 900mm × 1600mm
Weight: 750Kg
Solid crystal system:
Solid crystal head: Surface drawing style
Solid crystal wall: 90 °
Solid crystal dynamics: 20g ~ 200g
Chip XY table:
Stroke: 8 "× 8" (203mm × 203mm)
Accuracy: ± 0.3mil
Retest accuracy: ± 0.2mil
Chip Ring Size: 6 "or 4" (optional)
Thimble Z-stroke: 3mm
Solid crystal XY table:
Stroke: 4 "× 8.5" (203mm × 203mm)
Accuracy: ± 0.3mil
Retest accuracy: ± 0.2mil
Dispensing Systems: XY adjustable dispensing
Dual-dispensing system: XY Adjustable Dual Dispensing
DB380MD more than two-point rubber head ring solid crystal wafer
